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METHOD FOR MANUFACTURING SINTERED ALUMINUM NITRIDE COMPACT 发明申请

2022-07-31 4300 126K 0

专利信息

申请日期 2024-11-17 申请号 JP2003114631
公开(公告)号 JP2004315329A 公开(公告)日 2004-11-11
公开国别 JP 申请人省市代码 全国
申请人 TOKUYAMA CORP
简介 PROBLEM TO BE SOLVED : To provide a method for manufacturing a sintered aluminum nitride compact capable of manufacturing the sintered aluminum nitride compact having high thermal conductivity without entailing the degradation in strength and workability accompanying the higher thermal conductivity of the sintered aluminum nitride compact. SOLUTION : A molding composed of aluminum nitride powder of 0.3 to 3 μm in average particle size, sintering additive powder composed of rare earth compound and/or alkaline earth metal and an organic binder is degreased in such a manner that the amount of residual carbon attains 2, 500 to 10, 000 ppm and thereafter the obtained degreased body is fired for 35 to 100 hours in a neutral atmosphere of 1, 550 to 1, 900°C, thence the obtained sintered compact is fired for 10 to 50 hours in a reducing atmosphere of 1, 550 to 1, 900°C.


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