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PROCESS FOR FORMING FLUORINE ADDED CARBON FILM 发明申请

2022-07-31 1890 142K 0

专利信息

申请日期 2024-11-18 申请号 JP2003144613
公开(公告)号 JP2004349458A 公开(公告)日 2004-12-09
公开国别 JP 申请人省市代码 全国
申请人 OMI TADAHIRO; TOKYO ELECTRON LTD
简介 PROBLEM TO BE SOLVED : To provide a process for forming a fluorine added carbon film in which adhesion is enhanced between the fluorine added carbon film and an underlying film without causing any damage on the underlying film. SOLUTION : The process for forming a fluorine added carbon film on a substrate to be processed comprises a first step for performing surface treatment of the substrate to be processed with rare gas subjected to plasma excitation by a substrate processing equipment, and a second step for forming a fluorine added carbon film on the substrate to be processed wherein the substrate processing equipment has a microwave antenna electrically connected with a microwave power supply.


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