| 申请日期 | 2024-11-18 | 申请号 | JP2004147102 |
| 公开（公告）号 | JP2004346428A | 公开（公告）日 | 2004-12-09 |
| 公开国别 | JP | 申请人省市代码 | 全国 |
| 申请人 | UNITED TECHNOLOGIES CORPORATION | ||
| 简介 | PROBLEM TO BE SOLVED : To provide a bond coat not injurious to the mechanical properties of a silicon substrate. SOLUTION : The bond layer for a silicon substrate contains a metal which forms a heat-resistant oxide having a thickness of about 0.1 to 20 μm. The metals which form the heat-resistant oxides include chromium, tantalum, niobium, silicon, platinum, hafnium, yttrium, aluminum, zirconium, titanium, a rare earth metal, an alkaline earth metal, and a mixture thereof. | ||
|
您还没有登录，请登录后查看下载地址
|
客服热线：
手机版
二维码
