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SPUTTERING DEVICE 发明申请

2022-07-31 3290 53K 0

专利信息

申请日期 2024-11-19 申请号 JP2003172729
公开(公告)号 JP2005008923A 公开(公告)日 2005-01-13
公开国别 JP 申请人省市代码 全国
申请人 CYG GIJUTSU KENKYUSHO KK
简介 PROBLEM TO BE SOLVED : To provide a sputtering device which makes attachment and detachment of a target and an earth shield easy without deteriorating vacuum sealing property. SOLUTION : The sputtering device is equipped with at least a vacuum container, a substrate holder placed inside the vacuum container, a substrate placed on the substrate holder, the target used in a manner facing the substrate and a sputter electrode onto which the target is mounted. Here, the sputter electrode is composed of at least an electrode base part having a first spiral part formed on its outer periphery, an electrode body part having a second spiral part screwed to the first spiral part and a third spiral part, a back plate part which has a fourth spiral part screwed to the third spiral part and onto which the target is mounted and the earth shield part which surrounds the electrode base part, the electrode body part and the back plate part leaving prescribed gaps.


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