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High strength non-magnetic low thermal expansion alloy 发明授权

2022-07-31 1100 70K 0

专利信息

申请日期 2024-11-19 申请号 JP04339086
公开(公告)号 JP3614869B2 公开(公告)日 2005-01-26
公开国别 JP 申请人省市代码 全国
申请人 RES INST ELECTRIC MAGNETIC ALLOYS; TOHOKU TOKUSHUKO KK
简介 PURPOSE : To obtain a high-strength, non-magnetic, and low-thermal expansion alloy having high mechanical strength and low thermal expansion coefficient by regulating respective contents of Mn, V, and C to specific values, respectively. CONSTITUTION : This alloy has a composition consisting of, by weight ratio, 20-36% Mn, 0.001-5.0% V, 0.001-2.0% C, and the balance iron with inevitable impurities. Further, magnetic permeability is regulated to =2 kinds among the following elements : <=5.0% each of Ti, Zr, Hf, Nb, Ta, Cr, Mo, and W; <=4.0% each of Co, Cu, Zn, Cd, Al, Ga, In, Si, Ge, Sn, Sb, and rare earth elements; <=3.0% each of Au, Ag, Re, and Pt group elements; <=1.0% of Pb, Bi, S, Se, Te, and Ca; and <=1.0% B.


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