| 简介 |
PROBLEM TO BE SOLVED : To provide a circuit board and a method for manufacturing the circuit board using Si3 N4 ceramic where the adhesion property between a conductor layer and an insulator layer is strong and warpage and disconnection cannot occur easily, especially a high-junction-strength circuit board with one-layer wiring and multilayer wiring due to simultaneous baking. SOLUTION : In a circuit board 1 containing at least an insulator layer 2 and conductor layers 3 and 4, at least one layer of the entire insulator layer mainly consists of β-Si3 N4 and is a baked body containing at least one type of element which is selected from a group consisting of rare earth elements and alkaline earth and at least one layer out of an entire conductor layer contains at least one type of element which is selected from elements belonging to IVa, Va, and VIa groups of a periodic table and at least one type of element selected from a group consisting of rate earth elements and alkaline earth elements. |
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