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The semiconductor device and the substrate for forming an element 发明授权

2022-07-31 2940 84K 0

专利信息

申请日期 2024-11-19 申请号 JP2002220031
公开(公告)号 JP3621695B2 公开(公告)日 2005-02-16
公开国别 JP 申请人省市代码 全国
申请人 TOSHIBA CORPORATION3078
简介 A semiconductor apparatus includes a substrate, a buffer layer made of a monocrystal semiconductor material and formed on the substrate, a strained-Si layer formed on the buffer layer and having a lattice constant different from that of the buffer layer, a monocrystal insulating film formed on the strained-Si layer and made of a material having a rare earth structure with a lattice constant different from that of Si, and an electrode formed on the insulating film.


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