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Nozzle-Tip for Semiconductor Chip and Its Production 发明申请

2022-07-31 4810 169K 0

专利信息

申请日期 2024-11-19 申请号 KR1020030056692
公开(公告)号 KR1020050015923A 公开(公告)日 2005-02-21
公开国别 KR 申请人省市代码 全国
申请人 MAX TECH CO LTD; NAMKUNG MYOUNG CHAN
简介 PURPOSE : A ceramic nozzle tip for vacuum adsorption useful in a semiconductor manufacturing process and its manufacturing method are provided to improve mechanical properties such as abrasion resistance and fracture toughness, and thus to prevent operational errors caused by electromagnetic waves. CONSTITUTION : The ceramic nozzle tip(1) for vacuum adsorption comprises : a chip adsorbing part(11) on one side; a communicating hole(12) on the other side; and a connecting part(13) which connects the chip adsorbing part and a vacuum part of the outside through the communicating hole, wherein the nozzle tip(1) is produced by adding 0.1-5wt% of a rare earth oxide or metal oxide to zirconia(ZrO2), molding and sintering it, and carrying out hot isostatic pressing at 1300-1500deg.C under 100-150atm for 30minutes-1hour. © KIPO 2005


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