| 申请日期 | 2025-02-22 | 申请号 | KR1020187003788 |
| 公开（公告）号 | KR1020180018834A | 公开（公告）日 | 2018-02-21 |
| 公开国别 | KR | 申请人省市代码 | 全国 |
| 申请人 | SENJU METAL INDUSTRY CO | ||
| 简介 | To provide Cu ball that has less ± dose and high sphericity even when containing at least a certain amount of impurity elements other than Cu. Even when the purity thereof is 99.995% or less and U and Th contents are 5 ppb or less in order to suppress any software errors and decrease connection failure, ± dose is 0.0200 cph/cm 2 or less. Further, the sphericity of the Cu ball is unexpectedly improved by making the purity not more than 99.995%. | ||
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