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A method for etching treatment 发明授权

2022-06-06 2290 148K 0

专利信息

申请日期 2025-02-23 申请号 JP2014171686
公开(公告)号 JP6285322B2 公开(公告)日 2018-02-28
公开国别 JP 申请人省市代码 全国
申请人 東京エレクトロン株式会社
简介 In one embodiment, a method for etching a workpiece including a lower electrode and a multi-layer film disposed on the lower electrode, the multi-layer film including a first magnetic layer, a second magnetic layer, and an insulating layer interposed between the first magnetic layer and the second magnetic layer, through a mask, is provided. The method includes exposing the workpiece to plasma of first processing gas which contains first rare gas and second rare gas having an atomic number larger than that of the first rare gas, and does not contain hydrogen gas.


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