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A curing accelerator for epoxy resin, an epoxy resin composition and electronic device 发明授权

2022-06-06 4850 918K 0

专利信息

申请日期 2025-02-24 申请号 JP2013126047
公开(公告)号 JP6291729B2 公开(公告)日 2018-03-14
公开国别 JP 申请人省市代码 全国
申请人 日立化成株式会社
简介 PROBLEM TO BE SOLVED : To provide a curing accelerator for epoxy resin which can prevent the flowability of an epoxy resin composition from decreasing with time, an epoxy resin composition and an electronic part device.SOLUTION : A curing accelerator for epoxy resin comprises at least one selected from the group consisting of a compound represented by general formula (I-1) and intermolecular salt thereof. (In the formula (I-1), m is an integer of 1-3, n is an integer of 1-5, Ris a 1-18C hydrocarbon group, and Rand Rare a hydrogen atom or a 1-18C organic group.)


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