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COMPRESSIVE STRAIN SEMICONDUCTOR SUBSTRATES 发明申请

2022-06-06 2270 162K 0

专利信息

申请日期 2025-02-26 申请号 US15453118
公开(公告)号 US20180108736A1 公开(公告)日 2018-04-19
公开国别 US 申请人省市代码 全国
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION
简介 A method for forming a compressively strained semiconductor substrate includes forming a lattice adjustment layer on a semiconductor substrate by forming compound clusters within an epitaxially grown semiconductor matrix. The lattice adjustment layer includes a different lattice constant than the semiconductor substrate. A rare earth oxide is grown and lattice matched to the lattice adjustment layer. A semiconductor layer is grown and lattice matched to the rare earth oxide and includes a same material as the semiconductor substrate such that the semiconductor layer is compressively strained.


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