| 申请日期 | 2024-11-17 | 申请号 | JP10335469 |
| 公开（公告）号 | JP3579603B2 | 公开（公告）日 | 2004-10-20 |
| 公开国别 | JP | 申请人省市代码 | 全国 |
| 申请人 | W C Heraeus GmbH Co KG | ||
| 简介 | FINE WIRES OF A GOLD ALLOY CONTAINING 0.5 TO 0.9 W% OF COPPER AND SMALL PROPORTIONS OF PLATINUM OR AT LEAST ONE ELEMENT FROM THE GROUP OF ALKALINE EARTH METAAL AND RARE EARTH METALS ARE CHARACTERIZED BY A SPECIFIC ELECTRICAL RESISTANCE SIMILAR TO THAT OF GOLD AND A FAVORABLE STRENGTH-TO-ELONGATION RATIO. THEY ARE SUITABLE BOTH FOR WIRE BONDING AND FOR MAKING THE BALL BUMPS OF FLIP CHIPS. | ||
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